Xindium Plans InP Chips

CHAMPAIGN, Ill. -- Xindium Technologies, Inc., an early-stage optoelectronic integrated circuit manufacturer (OEIC), today revealed plans to enter the market for high frequency/high bit-rate semiconductor digital and optical component devices. Founded in February 2001 with venture backing from Vantage Point Venture Partners and encouragement from the University of Illinois at Urbana-Champaign (UIUC), Xindium will design, license and manufacture Indium Phosphide (InP)-based integrated devices for 40Gb/s and higher bit-rate applications. “Xindium’s products target the demand for high performance/high bit-rate devices that are driving integration onto a common chipset,” said Cindana Turkatte, president and CEO of Xindium. “Our expertise in the application and manufacture of high frequency Indium Phosphide devices gives us a powerful advantage. Early indications from customers have shown that we are on the right path with our technology, product development and customer-driven approach.”Xindium’s initial product offering will be customer selectable TIA and integrated PIN/TIA chips including chip-on-carrier devices for transceiver and transponder module makers. In addition, Xindium will produce a chip-on-carrier with a patent pending RF connector for more traditional transport module customers.Xindium Technologies Inc.